Zum ersten Mal können hochpräzise thermische Simulationsdaten in der elektronischen Lieferkette ausgetauscht und gleichzeitig das geistige Eigentum von Halbleiter-OEMs geschützt werden

(WK-intern) – Die Embeddable BCI-ROM-Technologie von Siemens bietet Modelle reduzierter Ordnung für die thermische 3D-CFD-Simulationsumgebung, die im Vergleich zu herkömmlichen, vollständig detaillierten thermischen Modellen eine hohe Genauigkeit aufweisen

Siemens Digital Industries Software gab heute bekannt, dass es einen innovativen Ansatz für den Austausch präziser thermischer Modelle von integrierten Schaltkreisen (IC) in die Elektroniklieferkette einführt.

Die Hauptvorteile sind der Schutz des geistigen Eigentums, die Verbesserung der Zusammenarbeit in der Lieferkette und die Genauigkeit von Modellen für stationäre und transiente thermische Analysen zur Verbesserung von Designstudien.

Die bahnbrechende Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM)-Technologie wurde in den neuesten Updates der Simcenter™ Flotherm™-Software für die Simulation der Elektronikkühlung aus dem Branchensoftware-Portfolio Siemens Xcelerator eingeführt und ermöglicht es einem Halbleiterunternehmen, ein genaues Modell zu erstellen, das dies kann können mit ihren Kunden geteilt werden, um sie in der nachgeschalteten hochauflösenden 3D-Wärmeanalyse zu verwenden, ohne die interne physikalische Struktur des IC freizulegen.

MediaTek Inc., ein globales Fabless-Halbleiterunternehmen und Marktführer in der Entwicklung innovativer Systems-on-Chip (SoC) für Mobil-, Home-Entertainment-, Konnektivitäts- und Internet-of-Things-Produkte (IoT), hat die Vorteile von Simcenter Flotherm genutzt, um die Effizienz in seinem Unternehmen zu steigern Zusammenarbeit mit Kunden. „Einbettbares BCI-ROM ist eine großartige Möglichkeit, unsere thermischen Modelle mit unseren Kunden zu teilen. Es verfügt über mehrere Hauptmerkmale: einfache Generierung, Vertraulichkeit, niedrige Fehlerrate und Eignung für stationäre und transiente Anwendungen“, sagte Jimmy Lin, technischer Manager, MediaTek Inc.

Siemens brings secure thermal digital twin technology to the electronics supply chain

• For the first time, high-fidelity thermal simulation data can be shared in the electronic supply chain while protecting semiconductor OEM’s intellectual property
• Siemens’ Embeddable BCI-ROM technology provides reduced order models for the 3D CFD thermal simulation environment that maintains high accuracy in comparison to traditional fully detailed thermal models

Siemens Digital Industries Software announced today that it is bringing an innovative approach for sharing accurate thermal models of integrated circuit (IC) packages to the electronics supply chain. The main advantages are protecting intellectual property, enhancing supply chain collaboration and accuracy of models for steady state and transient thermal analysis to enhance design studies.

Introduced in the latest updates to Simcenter™ Flotherm™ software for electronics cooling simulation from the Siemens Xcelerator portfolio of industry software, the breakthrough Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology allows a semiconductor company to generate an accurate model that can be shared with their clients for use in down-stream high-fidelity 3D thermal analysis without exposing the IC’s internal physical structure.

MediaTek Inc., a global fabless semiconductor company and market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and Internet of Things (IoT) products, has taken advantage of Simcenter Flotherm to drive efficiency in its collaboration with customers. “Embeddable BCI-ROM is a great way to share our thermal models with our customers. It has several key features: easy generation, confidentiality, low error rate, and suitability for steady-state and transient applications,” said Jimmy Lin, Technical Manager, MediaTek Inc.

Today’s electronics often have heat dissipation challenges that need to be resolved during design due to higher power density influenced by the miniaturization of semiconductor packages and electronic systems, trends for thin-form consumer products, or demanding processing requirements. As a result, the need for more detailed thermal models to help solve thermal management design tasks is growing. Increasingly, modern IC package architectures such as 2.5D, 3D IC, or chiplet-based designs have highly complex thermal management challenges that require 3D thermal simulation both during their development and during integration of IC packages into electronics products.

“Given electronics supply chain pressures and the growing complexity of IC packages, barriers to collaboration and thermal analysis efficiency during design must be eliminated where possible to support competitive development,” said Jean-Claude Ercolanelli, Senior Vice President, Simulation and Test Solutions, Siemens Digital Industries Software. “Our breakthrough new technology enables accurate thermal models to be shared securely within the electronics supply chain without exposing sensitive intellectual property, allowing all parties to resolve thermal issues faster and bring advanced products to market more quickly.”

To learn more about Siemens’ Embeddable BCI-ROM technology and how it can enable more efficient and secure collaboration, visit: https://blogs.sw.siemens.com/simcenter/embeddable-bci-rom-cfd-thermal-model/

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens‘ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries, Siemens Digital Industries Software – Accelerating transformation.

PR: Siemens Digital Industries Software PR Team

PB: Siemens’ Embeddable BCI-ROM technology enables accurate reduced order thermal models of IC packages to be shared for 3D CFD thermal analysis in the electronics supply chain